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When Will Sensing and Computing Collide?

At Computex 2024, over 1500 local and international companies gathered to showcase innovations in AI Computing, Advanced Connectivity, Future Mobility, Immersive Reality, Sustainability, and Innovation.

POLYN’s representative was on the ground in Taipei to witness one of the most notable trends – the significant shift in AI applications. AI moving from the cloud to the edge is a shift set to revolutionize the industry. AI-ready silicon is in almost every new product. A multitude of edge AI devices capable of sensing, seeing, hearing, detecting, and measuring are being prepared for deployment.

These developments present a promising opportunity for POLYN. For instance, manufacturers of gaming headsets and videoconference equipment need voice activity detection and voice extraction. Similarly, innovative products like smart clothes and healthcare devices require smart sensing technology. This demand opens up a potential avenue for POLYN to foster collaborations and explore new business opportunities.

As various new sensors are poised to be applied on the edge, data processing will emerge as a significant challenge. This is where POLYN’s revolutionary technology comes into play, efficiently handling a massive amount of raw data before sending it to the host.

Are the sensor manufacturers ready for this trend? Sensor +Test 2024 trade show, which took place in Nuremberg, may answer this question. Interesting innovations there included TDK’s display of a piezo polymer material for robotic skin capable of sensing impact. No hitting of poor Boston Dynamic robots will go unnoticed with such material! Sensor signal processing is done with deep learning neural networks, which would require more power efficiency in a power-constrained environment.

STMicro demonstrated an edge AI vibration monitoring solution based on the STM32 chip. The solution can detect a problem in various units based on frequency variations. But it is still a wired solution, not wireless, so there’s a way to improve.

There are still no smart sensors where the sensing and processing units are bundled, so POLYN’s concept of integrating the AI computing chip in a sensor node received a warm welcome. There were many interesting conversations with MEMSensing, TDK, Honeywell, STMicro, Sensata, Beckhoff, Amate, and others.